Domestic companies have developed Mach-Zehnder modulators (MZM) and thin-film lithium niobate (TFLN) modulators, supporting 400G and 800G high-speed optical modules. “Localization of optical module chips” refers to China's capability to independently develop and manufacture the core chips and key components used in high-speed optical communication modules, including electrical chips (DSP / Driver / TIA), optical device chips (laser / photodetector), and silicon. Optical modules are essential for high-speed data transmission, and the chips inside— lasers, modulators, photodetectors, driver ICs, TIAs, and DSP ICs—determine performance, reliability, and efficiency. Developing domestic chips not only addresses supply chain security but also provides. Spurred by the AI computing boom and large-scale 5G deployment, optical modules, the critical backbone of communication infrastructure, are undergoing a significant shift towards domestic production in China. Featuring the world's leading market shares and accelerating upgrades, China's tech supply.
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