Three-dimensional (3D) nano-printing of freeform optical waveguides, also referred to as photonic wire bonding, allows for efficient coupling between photonic chips and can greatly simplify optical system assembly. The fabrication and assembly of 3D optical modules based on active interposer-integrated edge couplers and TSV are realized in this paper. The problem. 1University of California Davis, Davis, CA, United States. Ben Yoo, "3D Hybrid Bonded EIC-PIC Integration and Packaging Technologies," in Optical Fiber Communication Conference (OFC) 2026, Technical Digest Series (Optica. We describe a novel system which uses hybrid 2. 5D/3D integration to compose a state-of-the-art FPGA compute chiplet, three electrical interface chiplets, and three photonic interface chiplets. We use register-transfer-, gate-, transistor-, and device-level simulations to demonstrate the potential. The OIF is an international nonprofit organization with over 150 member companies, including the world's lead-ing carriers and vendors.
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