0mm, COB delivers pixel pitches from P0. 1mm increments — making true 4K, 8K, and even 16K resolution achievable on large LED displays. The COB process refers to a technology that directly mounts bare chips onto a printed circuit board (PCB), connects them via gold wire bonding, and then encapsulates and protects the chips and wires using organic adhesive. Compared with conventional processes, the COB process offers high packaging. The optics module is comprised of Si photodiodes, optical components, and current-to-voltage conversion circuit. Our lineup includes filter type spectroscopic modules (C13398 series) specialized for signal detection of many known wavelengths, and spectroscopic modules with light sources (C16028. COB utilises high precision die and wire bonders to attach chips and subcomponents to a PCB electronically. Optical coupling, with input and output optical fibers, is then achieved with lens arrays and waveguide structures. With 10 Light Emitting Surface (LES) options across the entire range, typical outputs from 650 to over 20,000. in recent years, high-speed optical modules often mention the COB (Chip-on-Board) process.
